Hillstone Networks has made an announcement stating that its self-developed ASIC security-tailored chip has successfully had the wafers returned from the mass production tape-out phase. Following a thorough round of testing, every functional and performance metric has hit the mark. The upcoming generation of security products, which are outfitted with this cutting-edge chip, are now primed for distribution. Mass sales and subsequent delivery are projected to kick off in the first quarter of 2026.
