On November 20, the 2025 Integrated Circuit Development Forum (Chengdu - Chongqing Region) and the 31st Integrated Circuit Design Industry Exhibition (ICCAD - Expo 2025) kicked off in Chengdu. Luo Zhenqiu, the General Manager of TSMC (China), pointed out that the 3 - nanometer (3nm) process embodies the ultimate and most refined iteration of FinFET technology.

He disclosed that TSMC's N3E process has already entered mass - production phase for flagship mobile devices as well as high - performance computing (HPC) and artificial intelligence (AI) products. Meanwhile, the N3P process is on track to start production as scheduled in the fourth quarter of 2024, following in the footsteps of the N3E process.

In response to the diverse requirements of specific applications, TSMC has rolled out a range of N3 variants. The N3X variant is tailored for client central processing units (CPUs), the N3A variant is designed specifically for the automotive industry, and the N3C variant caters to value - tier products.

It is widely expected that the N3 process will emerge as a high - volume and long - running process node. By September 2025, it had already secured approximately 100 new process technology (NTO) orders.