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ETANG Co., Ltd.: Its Three Main Equipment Categories Are Applicable to HBM Chip Production
2025-11-18 /
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Author：小编
Some investors raised questions about whether ETANG Co., Ltd. possessed equipment or technical capabilities relevant to the production of HBM (High-Bandwidth Memory) chips. In response, ETANG Co., Ltd., a frontrunner in the specialized sector of integrated circuit equipment, clarified that its three primary equipment categories—plasma dry descum, rapid thermal processing, dry etching, and plasma surface treatment—are all suitable for the production of HBM chips. This reflects the company's robust technical foundation and adaptability within the advanced semiconductor manufacturing landscape.
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