Media sources have reported that billionaire entrepreneur Elon Musk is in the process of constructing a comprehensive chip production and packaging chain within the United States. This ambitious project will encompass every link in the supply chain, starting from printed circuit boards (PCBs) and extending all the way to fan - out panel - level packaging (FOPLP) chips.

In Texas, the PCB center has already kicked off its operations. Meanwhile, the installation of equipment at the FOPLP factory has commenced. Small - scale mass production at this factory is anticipated to begin in the third quarter of 2026.

Moreover, Musk has grand plans to build a colossal wafer fab. Initially, this fab is set to have a monthly production capacity target of 100,000 wafers. Eventually, the goal is to ramp up production to a staggering 1 million wafers per month. This move is aimed at fulfilling the growing demands of companies under Musk's umbrella, including Tesla, SpaceX, and Starlink.