Hanhua Semiconductor Makes Four Groundbreaking Achievements in 2025! China's Pioneering 3DIC Heterogeneous Integrated GaN Plus Platform Outpaces Moore's Law - Chip

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Hanhua Semiconductor Makes Four Groundbreaking Achievements in 2025! China's Pioneering 3DIC Heterogeneous Integrated GaN Plus Platform Outpaces Moore's Law

1 week ago / Read about 0 minute

Author：小编

In 2025, Hanhua Semiconductor is set to achieve four significant milestones. Looking to the future, Hanhua will intensify its efforts in the integration and innovation of GaN epitaxy and 3DIC (Three-Dimensional Integrated Circuit) technologies. It will expedite the large-scale production of MicroLED microdisplays, facilitate the wider adoption of AR (Augmented Reality) technology in professional settings, and propel the global display industry into the 'MicroLED Era'.

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