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On August 19, 2025, Pegatron Holding approved a proposal to invest 8 billion Chinese yuan in the construction of an industrial park within the Huaian Park. The objective of this investment is to expand production capabilities for advanced products such as SLP (Substrate-like PCB), high-end HDI (High-Density Interconnect), and HLC (High-Layer Count) PCBs, while also bolstering the manufacturing capacity of flexible printed circuits (FPCs). This strategic move aims to cater to the burgeoning demand for PCB solutions in AI-driven markets, encompassing servers, optical communications, humanoid robots, and smart automobiles. The project, funded entirely by the company's internal capital, is scheduled to span from the second half of 2025 through 2028.
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