From April 11 to 12, the High-Level Forum on Intelligent Electric Vehicle Development (2026) took place at Phase II of the China National Convention Center in Beijing. The forum centered on the intelligent, eco-friendly, integrated, and globally oriented development of new energy vehicles. During the event, Yu Kai, founder and CEO of Horizon, revealed that the company will embark on a strategic upgrade this year, introducing an integrated cabin-driving chip solution along with supporting software. On April 22, Horizon is set to launch China’s first integrated cabin-driving AI chip, named Xingkong. This innovative chip consolidates computational tasks that previously required two separate domains and two distinct chips into a single unit. By doing so, it not only enhances the user experience but also achieves significant advancements in speed limits, heat dissipation, and cost efficiency. Given the rising prices of DDR memory, this chip is expected to save between RMB 1,500 and 4,000 per vehicle, marking a substantial leap forward in automotive technology.