The much-anticipated Xiaomi 18 Fold is slated for release at 7 PM on September 7. This launch will mark the global premiere of Changxin's LPDDR6 memory chip. However, given Changxin's restricted production capacity in the initial phase, the Xiaomi 18 Fold will also, to some extent, employ Hynix memory chips that boast identical specifications. In addition to this, the Xiaomi 18 Fold will make its debut equipped with Xiaomi's self-developed Xuanjie O3 processor. This processor has the potential to propel the device to achieve an AnTuTu benchmark score that surpasses 5 million points. LPDDR6 represents the sixth-generation low-power memory standard, which was unveiled by JEDEC in July 2025. On August 29, 2026, Changxin declared the mass production of its self-developed LPDDR6 memory chips. This move positions Changxin as the world's first vendor to commercialize products that conform to this standard. These chips offer a peak speed of 12,800 Mbps and a maximum single-chip capacity of 16 GB.