On September 15, the 2026 AIDC Industry Development Conference cum 3D Data Center On-Site Meeting convened in Wuhu, Anhui Province. During the event, Huawei formally introduced the world's inaugural 3D data center and unveiled a monograph alongside a collection of concise design blueprints, with the objective of collaborating with industry stakeholders to establish a novel framework for Artificial Intelligence Data Centers (AIDC). The 3D data center adopts the design philosophy of chip fabrication plants, stacking the traditionally horizontally arranged functional areas of data centers vertically to create a four-tiered structure. This structure comprises a cooling layer, IT equipment layer, power supply layer, and backup power layer.

Wang Tao, Vice Chairman of Huawei, emphasized that with the swift escalation in demand for expansive models boasting tens of trillions of parameters and Tokens, AI infrastructure is confronted with more stringent demands. Ascend supernode clusters, equipped with over 100,000 cards, are poised to become the norm. Leveraging hierarchical decoupling and three-dimensional stacking technologies, the 3D data center furnishes supercomputing prowess to bolster Ascend supernode clusters.