As super nodes gain prominence within the new computing infrastructure landscape, liquid cooling technology has emerged as a central focus within the industry. At the 2026 World Artificial Intelligence Conference, reporters observed that server vendors such as Huawei, ZTE, New H3C, and Inspur have fully upgraded their super node thermal management systems to incorporate liquid cooling solutions. These advancements encompass both traditional cold plate liquid cooling and the cutting-edge immersive liquid cooling techniques. According to CICC's forecasts, 2026 will herald the first year of substantial growth for liquid cooling technology. The global market size for liquid cooling in intelligent computing centers is projected to reach RMB 114.7 billion, marking a remarkable year-on-year increase of 273%. This trend is expected to persist, with continued high growth anticipated in 2027. Industry experts attribute this surge to the escalating demand for high-performance computing, which is propelling the continuous evolution and widespread adoption of liquid cooling technologies. Furthermore, with the declining prices of fluorinated liquids, immersive liquid cooling is poised to transition into the engineering implementation phase, opening up vast market opportunities.