CITIC Construction Investment has highlighted that the burgeoning demand for computing power is emerging as a pivotal growth catalyst for the PCB industry. This trend is steering PCB products tailored for AI applications towards advancements characterized by increased layer counts, higher density, faster speeds, reduced losses, and enhanced reliability. With the transition of AI server architectures from CPUs to GPU/ASIC clusters, PCBs are now subject to more stringent technical demands concerning quantity, layer count, material selection, hole structures, circuit precision, and overall reliability. This shift has spurred a rapid surge in demand for high-layer-count boards and sophisticated HDI (High-Density Interconnect) technologies.

Furthermore, the iterative development of M7-M9 low-loss substrates, coupled with the accelerated adoption of precision manufacturing processes like mSAP (modified Semi-Additive Process), has solidified the industry's trajectory towards high-end upgrades. This evolution is not only fostering enhancements in the entire spectrum of process equipment but is also unlocking new avenues for growth within the PCB equipment sector and its associated consumables market.