At the AI Data Center Optical Communications and Interconnect Technologies Conference, Corning introduced its Glass Bridge, a glass optical interconnect component. Designed for the co-packaged optics and glass substrate semiconductor packaging markets, this component utilizes wafer-level ion-exchanged waveguide technology to effectively address the physical adaptation challenges between photonic chips and optical fibers. It enables high-density optical I/O interfaces, simplifies the alignment and assembly process, and eliminates the need for traditional transceivers or long fiber array units. The first product supports core pitches of 30 microns or more for photonic chips, with a target coupling loss of less than 2dB. Additionally, Corning showcased a next-generation CPO architecture that integrates glass substrates with optical interconnects and launched the GlassWorks AI platform, which covers the entire optical communication link in data centers. Currently, Corning is collaborating with multiple partners to develop related technologies, has expanded its investment in optical communication manufacturing facilities, and signed long-term supply agreements with hyperscale cloud providers.