On September 17, during the 2025 AIDC Industry Development Conference, Yang Chaobin, who serves as both a director at Huawei and the CEO of its ICT Business Group (BG), emphasized that as AI computing power and chip power consumption experience rapid growth, liquid-cooled data centers have emerged as an unavoidable option for AI Data Centers (AIDC). At present, the industrial chain for liquid-cooled data centers, along with efforts towards standardization, still requires further enhancement. When advancing standardization initiatives, it is crucial to proactively plan for the overall power distribution and the specific requirements for individual cabinets in future AI Data Centers. This planning should encompass various aspects, including power supply, cooling systems, and load-bearing capacity. Additionally, careful consideration must be given to small electromechanical systems that are closely intertwined with liquid-cooling equipment. These include the power capacity of the Coolant Distribution Unit (CDU), the diameter and connection schemes of secondary pipelines, as well as the interfaces with surrounding systems.