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Oulai New Materials: Premier Shipment of Ultra-High Purity Copper Target Material for Integrated Circuit Production
2025-06-05 /
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Author：小编
Oulai New Materials has triumphantly completed its initial shipment of high-purity copper target material to a new client. This exceptional material boasts a purity level surpassing 4N (99.99%), featuring a fine grain size of less than 100μm, low resistivity, and robust, consistent resistance to electromigration. It stands as a pivotal component in the metallization process of semiconductor wafers, integral to the conductive layers and interconnect structures of integrated circuits.
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