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Nvidia CEO Jen-Hsun Huang Visits Taichung; Blackwell to Embrace CoWoS-L Packaging Technology
2025-01-18 /
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Author：小编
At the annual meeting, Nvidia's CEO, Jen-Hsun Huang, revealed that the company will transition from the CoWoS-S packaging technology to the more sophisticated CoWoS-L technology. The latest Blackwell chips will predominantly utilize CoWoS-L technology to boost performance and cut costs. Meanwhile, the previous generation of Hopper chips will maintain the use of CoWoS-S technology. This shift is anticipated to spur a rise in the demand for CoWoS-L production capacity.
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