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November 12 – Tongxin Intelligence has completed hundreds of millions of yuan in seed and angel round financing, with investors including the Tsinghua Alumni Seed Fund, the Beijing Institute for General Artificial Intelligence, Songlin Technology, Pingzhi Information, Dark Matter Intelligence, and Yuzi Zhangquan, among others. The funds will be primarily used for core architecture design and R&D ahead of chip tape-out. Founded in April 2026, Tongxin Intelligence was initiated by AI scientist Zhu Songchun, director of the Beijing Institute for General Artificial Intelligence and chair professor at Peking University and Tsinghua University. Its first product is positioned as an inference chip supporting AGI algorithms, targeting applications such as large models, world models, and general agents, with FPGA prototype validation planned for early December.
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