On September 30, news emerged that SK Hynix is set to significantly enlarge the scale of its outsourcing operations for memory semiconductor flip chip packaging. Building on its successful collaboration with OSAT (Outsourced Semiconductor Assembly and Test) provider A-PROTECH, SK Hynix has chosen to further extend its outsourcing endeavors to WINPAC. This decision marks a revitalized partnership between the two companies, coming four years after their previous collaboration.

Under this new agreement, SK Hynix intends to entrust Winpac with the packaging responsibilities for certain DDR4 and DDR5 DRAM memory chips. Presently, Winpac has concluded all preparatory tasks, including equipment debugging, at its packaging facility located in the P zone. The company has now transitioned into the mass production phase.

The P zone is specifically designated for packaging high-performance products, encompassing DRAM, NAND flash memory, and eUFS (embedded Universal Flash Storage). Notably, the monthly production capacity of this zone has witnessed a boost, escalating from 44 million units to an impressive 50 million units.