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SK Hynix Outsources Additional Memory Semiconductor Packaging Business to WINPAC
2 day ago /
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Author：小编
SK Hynix has further expanded the scale of outsourcing for memory semiconductor flip-chip packaging. In addition to the existing outsourcing partner, OSAT company A-PROTECH, WINPAC has been added as a new outsourcing partner. After completing the relevant preparatory work at its P Campus packaging factory, WINPAC has officially commenced mass production of DDR4 and DDR5 DRAM. This factory is primarily responsible for packaging high-performance products such as DRAM, NAND Flash, and eUFS. Recently, the monthly production capacity of the factory has been increased from 44 million units to 50 million units.
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