Sunfine New Material Technology: Mingyi Electronics’ VCP Plating Equipment for Optical Modules Set for Delivery to a Premier AI Server PCB Manufacturer
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Author:小编   

On September 18, Sunfine New Material Technology made an announcement via its official WeChat account that the Vertical Continuous Plating (VCP) equipment for optical modules, produced by its subsidiary Mingyi Electronics, has been dispatched and is on the verge of being delivered to a top-tier domestic AI server PCB manufacturer. This state-of-the-art equipment is designed to fulfill the requirements for PCB plating and IC substrate plating in advanced processes, such as the Modified Semi-Additive Process (mSAP). Moreover, it is ideally suited for PCB plating processes in optical modules spanning from 800G to 1.6T, catering to the evolving needs of the industry.