Micron has introduced the world's first 512GB DDR5 memory module, featuring a 3DS RDIMM design that stacks DRAM chips using through-silicon via technology, significantly increasing capacity per package. In a dual-socket 24-DIMM configuration, a single server can achieve up to 12TB of memory capacity with a transfer rate of up to 9200MT/s. Compared to four 128GB modules, this product reduces energy consumption by over 60% and is expected to enter mass production in the second half of 2027. Currently, AMD and Intel are validating this product on their next-generation server processor platforms.
