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Samsung Electro-Mechanics and Qualcomm Reportedly Join Forces on Organic Bridge Technology
4 day ago /
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Author：小编
On September 14th, reports surfaced indicating that Samsung Electro-Mechanics has been collaborating with Qualcomm for over a year on the development of 'organic bridge' technology, specifically tailored for cutting-edge AI chip packaging. In parallel, Samsung Electro-Mechanics is also working with other clients to develop 2.1D packaging substrates utilizing this organic bridge technology. The company's strategy involves integrating organic bridges, featuring 5 to 7 redistributed layers, into FC-BGA substrates. This integration aims to achieve a reduction in line widths and spacings to a range of 1.5 to 2 micrometers. This innovative technology is poised to serve as a viable alternative to Intel's EMIB silicon bridge packaging technology.
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