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On September 10, during the semi-annual performance review held on the same day, Wang Shunbo, Chairman and CEO of Yongxin Electronics, announced that for the latter half of 2026, the company will persist in executing a key customer strategy. While reinforcing its collaborative efforts with current core clients, Yongxin Electronics will proactively seek out overseas premier customers and those specializing in 2.5D advanced packaging, and push forward with verification and product introduction initiatives. Furthermore, the company will methodically progress in the establishment of advanced packaging production lines, including Bumping, wafer-level packaging, FC, and 2.5D/3D, thereby continually bolstering its comprehensive one-stop service delivery capabilities.
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