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Report: Samsung Opens Advanced Chip Packaging R&D Center in Japan
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Author：小编
On September 8th, it was reported that Samsung Electronics has launched an advanced semiconductor packaging research and development facility in Yokohama, Japan. Previously, Samsung planned to invest approximately 40 billion yen over five years starting from 2024 to expand the laboratory's hardware facilities and enhance advanced packaging technologies. The laboratory will collaborate with local Japanese companies, universities, and research institutions to jointly develop next-generation packaging materials and processes. Samsung anticipates that the number of researchers at the facility will exceed 100 by 2027.
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