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On September 8, 2026, ASML unveiled significant progress in the application of high-numerical-aperture extreme ultraviolet (EUV) lithography technology, achieved in collaboration with industry giants TSMC, Samsung Electronics, and Intel. TSMC has outlined plans to integrate this cutting-edge technology into large-scale production for its advanced processes, with implementation slated to commence in 2030. Meanwhile, Samsung has set its sights on deploying the technology for large-scale DRAM production, targeting a timeline no later than 2028. Furthermore, the four companies have forged a consensus on transitioning photomask technology specifications, opting to upgrade from the traditional 6-inch to the more efficient 12-inch photomasks. This strategic move is aimed at bolstering production efficiency and driving down costs.
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