ASML and TSMC have jointly launched an industry collaboration initiative aimed at driving the transition to 12-inch photomasks to fully unlock the potential of High NA EUV lithography technology. The two parties plan to establish a pilot production line for 12-inch photomasks by 2031 and complete preparations for a complete lithography system for advanced process node production by 2033. The initiative has garnered widespread support from the industry, with multiple companies expressing their intention to join.
