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Shijia Photonics: Plans to Raise No More Than 2.8 Billion Yuan through Private Placement for Projects Including High-Speed AWG Chip and Optical Interconnect Component Capacity Building
1 week ago /
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Author：小编
On July 15, Shijia Photonics announced its plan to issue A-share stocks to specific objects, aiming to raise funds not exceeding 2.8 billion yuan. The funds will be used for projects such as the capacity building of high-speed AWG chips and optical interconnect components, the industrialization of continuous-wave (CW) laser chips and COC, the capacity expansion of high-density optical interconnect devices (MPO/MMC), and the supplementation of working capital.
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