On July 6, Hubei Dinglong Holdings Co., Ltd., a frontrunner in material application innovation for pivotal industries across China, formally lodged its application to list H shares on the Hong Kong Stock Exchange, with aspirations to secure a listing on the main board. China Merchants Securities International and CITIC Securities have been appointed as the joint sponsors for this endeavor.

Established in 2000, Dinglong Shares initially commenced operations as a modest manufacturer of printing and copying consumables. It subsequently diversified into the semiconductor materials sector, emerging as a domestic trailblazer in CMP (Chemical Mechanical Planarization) polishing pads. The company boasts a monthly production capacity of 50,000 units and commands a market share of 38.5%. Beyond CMP polishing pads, Dinglong Shares also supplies semiconductor display materials, photolithography materials, and advanced packaging materials.

In the financial year 2025, the company reported a revenue of RMB 3.66 billion and a net profit of RMB 720 million, underscoring its robust financial performance and market presence.