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JEDEC Eases Standards: Samsung and SK Hynix Might Defer Hybrid Bonding Implementation in HBM4
2 day ago /
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Author：小编
Hybrid bonding was previously hailed as a pivotal packaging enhancement technology for next-gen High Bandwidth Memory (HBM). Nevertheless, based on the most recent reports from South Korean media, Samsung and SK Hynix could potentially delay the integration of this technology into the HBM4 generation. Instead, they plan to introduce it in the subsequent HBM4E generation. Presently, JEDEC—the global entity tasked with establishing semiconductor industry standards—is reassessing the specifications concerning HBM stack thickness. This shift not only influences the timeline for adopting hybrid bonding but is also reshaping the technological rivalry among top memory producers and their principal customers.
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