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The first large panel-level packaging direct-writing lithography equipment from Xinzhi Microelectronics Equipment secures a large order in advanced packaging
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Author：小编
On July 3, Xinzhi Microelectronics Equipment announced that its independently developed PLP2000, the first 510×515mm panel-level packaging direct-writing lithography equipment in China, has completed its technical finalization and successfully secured an order from a core customer in the advanced packaging field, achieving a breakthrough in the domestic production of large panel-level advanced packaging lithography equipment.
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