CSC has announced that the commercialization of diamond-based thermal dissipation materials is gaining momentum, with large-scale application products already making their mark in both the AI server and consumer electronics sectors. In the realm of computing power, Mitac and AMD's diamond-enhanced thermal dissipation AI servers, along with Sugon's megawatt-scale diamond-copper immersion liquid-cooled cabinets, have been rolled out on a commercial scale. Furthermore, Akash's GPU servers, cooled by diamond technology, have garnered significant orders. Among consumer products, MSI's gaming graphics cards, Lenovo's AI ultrabooks, and high-end PC water-cooling units all incorporate diamond composite thermal solutions. Intel's upcoming server processors are also anticipated to utilize diamond materials for their superior thermal conductivity. As AI hardware with high computing power continues to evolve, the market potential for diamond materials with high thermal conductivity is vast, and the companies involved in the related industrial chain represent a promising long-term investment opportunity.