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Tongfu Microelectronics Addresses and Refutes Rumors Regarding NPO Packaging and Testing Orders
12 hour ago /
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Author：小编
On June 22, Tongfu Microelectronics took to an investor interaction platform to clarify and dispel prevailing market rumors, explicitly stating that it is not currently engaged in any NPO packaging and testing operations, and that the rumors circulating in the market are unfounded.
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