Ming-Chi Kuo has conducted an in-depth analysis of TSMC’s cutting-edge advanced packaging technology, highlighting that glass core substrates are indispensable for the production of next-generation AI chips. This technological breakthrough was first unveiled by TSMC during its presentation at the JPCA Show in Japan on June 11. In collaboration with Ibiden and Innolux, TSMC has successfully developed glass core substrates featuring a three-layer structural design, where the glass core is sandwiched between two layers of ABF build-up.

The use of a thinner glass substrate significantly shortens the vertical conduction path through glass vias. This, in turn, reduces conduction resistance and loop inductance, enhances power integrity, and ensures a more stable power supply system for the chips. Given these advantages, companies such as NVIDIA have expressed keen interest in adopting this technology. TSMC is poised to initiate mass production of glass core substrates between the fourth quarter of 2028 and the first quarter of 2029.