LG Innotek has set its sights on significantly bolstering its production capabilities for Flip Chip Ball Grid Array (FCBGA) substrates. As part of its initial expansion phase, the company is poised to invest a staggering 1 trillion Korean won in establishing a state-of-the-art semiconductor substrate factory in Vietnam. This strategic move is designed to propel its packaging substrate business to new heights. Presently, LG Innotek is actively engaged in discussions with its clientele concerning a second-phase investment, with the overarching goal of enhancing the production capacity of FCBGA substrates tailored specifically for AI servers. These discussions have yielded substantial progress, signaling a promising future for the company's endeavors in this domain.

Furthermore, LG Innotek remains committed to augmenting production at its existing facility in Gumi, North Gyeongsang Province, South Korea. Building upon its previously disclosed investment of 600 billion Korean won, the company intends to further scale up its FCBGA production operations. This expansion will be meticulously calibrated based on the mutually agreed-upon output volumes with its esteemed customers, ensuring a seamless and efficient production process.