Insights from supply chain sources indicate that TSMC is broadening its glass substrate supply chain, marking the initial stride towards setting up a robust supply system for its CoPoS advanced packaging technology. Initially, these glass substrates are earmarked for use in upgraded CoWoS advanced packaging. Among TSMC's partners are panel manufacturer Innolux and substrate and material supplier Ibiden, among others. TSMC has initiated the 'CoWoS Glass Substrate Development Program,' working in tandem with Ibiden and Innolux to collectively assess the viability of integrating glass substrates into CoWoS advanced packaging. This step signifies the advent of glass substrate technology into the industrial verification phase. Simulation verification results from the trio of companies reveal that glass substrates offer notable enhancements in packaging performance, including a 16% improvement in reducing package warpage, a 19% reduction in the coefficient of thermal expansion, and a 31% boost in elastic modulus. TSMC Chairman Mark Liu disclosed that the company has set up a CoPoS pilot production line and anticipates achieving large-scale mass production within the next 2 to 3 years. Nevertheless, the widespread mass production of glass substrates remains a hurdle, as TSMC must persist in addressing core process challenges such as optimizing glass thickness, devising layout designs for large-scale CoWoS packaging, implementing copper filling processes for glass via holes, and managing large-area warpage control.