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Breaking Through the Bottlenecks of Traditional Processes! Yuanfu's Integrated Thinning and Dry Polishing Machine 'Unlocks' the Path to Low-Cost and High-Yield
6 day ago /
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Author：小编
Recently, Jiangsu Yuanfu Semiconductor Technology Co., Ltd. successfully delivered an integrated thinning and dry polishing, as well as film application and removal machine to a major customer in the semiconductor packaging and testing field. This equipment employs multi-axis coordinated control and adaptive process adjustment algorithms, enabling high uniformity control of wafer thickness and low-stress processing. It will support the customer's advanced packaging production line upgrades and provide a stable solution for high-quality processing of ultra-thin wafers.
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