On May 25, the 2026 International Symposium on Circuits and Systems convened in Shanghai. During this event, He Tingbo, a member of Huawei's board and president of its Semiconductor Business Department, officially introduced the "Tao's (τ) Law." This announcement signifies a groundbreaking moment, as it represents China's inaugural proposal of a novel principle for industrial advancement within the global semiconductor landscape. The law shifts the focus from "geometric miniaturization" to "temporal miniaturization," aiming to consistently diminish signal propagation delays and augment transistor density through cutting-edge technologies like logic folding. This, in turn, propels the progression of semiconductors and electronic systems.

Drawing on this principle, Huawei has successfully crafted and mass-produced 381 distinct chip models over the past six years. Moreover, the company is set to unveil a new Kirin mobile phone chip, incorporating logic folding technology, this coming autumn. Projections indicate that by 2031, the transistor density of high-end chips developed in accordance with this law will achieve a level comparable to that of the 1.4-nanometer process.