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Huawei's New Packaging Technology Creates 122TB SSD
2 day ago /
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Author：小编
According to Blocks & Files, Huawei showcased its high-capacity SSD series based on the self-developed DoB packaging technology at the ID Forum 2026 event held in Paris from May 20 to 21, 2026. The SSD series has already mass-produced two models with capacities of 61.44TB and 122.88TB, with plans to introduce a 245TB version. The DoB technology achieves higher density and better performance by directly packaging NAND dies onto PCB circuit boards, bypassing the limitations of traditional TSOP or BGA packaging. This technology enhances capacity density, reduces production costs, and provides a domestically produced solution for AI data centers and massive storage scenarios.
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