On January 17, 2026, Micron Technology, a prominent U.S.-based memory chip manufacturer, declared that it had entered into an exclusive letter of intent with Powerchip Semiconductor Manufacturing Corporation (PSMC). Under this agreement, Micron plans to purchase PSMC's P5 wafer fabrication plant, situated in Tongluo Township, Miaoli County, Taiwan, China, for a cash consideration of US$1.8 billion. The facility boasts a fully equipped 300mm wafer fab cleanroom, covering an expansive area of 300,000 square feet.

This strategic acquisition is poised to significantly bolster Micron's DRAM production capabilities within the global memory market. It is particularly geared towards addressing the escalating demand for cutting-edge DRAM products, such as high-bandwidth memory (HBM), which are integral to the burgeoning artificial intelligence sector. The transaction is slated for completion in the second quarter of 2026. Following this, Micron intends to ramp up DRAM production in a phased manner, with expectations of a substantial surge in DRAM wafer output commencing from the second half of 2027.