In recent years, propelled by the acceleration of domestic substitution, a surge in computing power demand, and robust policy support, China's integrated circuit industry has shown strong development momentum. According to the latest data, from January 2025 to February 5, 2026, the financing scale in China's integrated circuit sector has exceeded 83.5 billion yuan, with a cumulative total of 1,197 financing events. This positions the industry as a highly capital-attractive segment within the hard technology domain. Currently, capital allocation is becoming more targeted, with the average size of each financing event reaching approximately 70 million yuan. Funds are increasingly concentrated in core areas, including advanced process nodes at 14nm and below, AI computing chips, and high-end memory chips. Regarding the distribution of financing, large-scale investments are primarily directed toward semiconductor manufacturing, memory chips, and AI chips. Among these, semiconductor manufacturer Wanxin Integrated secured 9.55 billion yuan in Series A financing, marking it as the company with the largest annual financing scale. Memory chip enterprise Changcun Group completed a 9.4 billion yuan Series B financing round. The AI chip sector has emerged as a "high-frequency track" for large-scale financing, with companies such as Xiwang Sunrise and Kunlun Core each securing over 1 billion yuan in funding. Capital market interest in the integrated circuit industry continues to grow, with a clear trend of concentrated investment. This is effectively driving the industry's breakthroughs and development toward high-end and core segments.