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Industry Analysis: Intel's EMIB Gains Favor Among AI ASICs
2025-11-24 /
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Author：小编
On November 24th, news emerged that Apple and Qualcomm are recruiting engineers with expertise in Embedded Multi-chip Interconnect Bridge (EMIB) packaging, indicating that Intel's packaging technology is regaining momentum, partly due to TSMC's capacity constraints. This shift demonstrates that Intel's advanced packaging solutions are rapidly gaining attention among smartphone SoC and AI ASIC customers.
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