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At today's 2025 Intel Technology Innovation and Industrial Ecosystem Conference, Intel unveiled that mass production of its 18A process has commenced at its Fab 52 plant in Arizona. This advanced process integrates Gate-All-Around (GAA) transistors and backside power delivery technology, which bring about substantial improvements in energy efficiency and transistor density. When compared to its predecessor, the 18A process not only achieves a 15% performance boost at the same power consumption level but also ups the transistor density by 30%. Intel mentioned that this technology will act as the bedrock for the company's upcoming three generations of products, and it is continuously striving to expedite the development of subsequent products built on this technology.
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