Recently, the 2025 Asian Solid-State Circuits Conference (A-SSCC) took place in Daejeon, South Korea. As a premier international academic conference in the realm of Asian solid-state circuits, it served as a gathering point for distinguished experts, scholars, industry representatives, and up-and-coming researchers from across the globe. The focus was on the latest research breakthroughs and upcoming trends in integrated circuit design.

Assistant Professor Tang Xiyuan from Peking University was honored with an invitation to present an academic talk at the special "Rising Star Express" forum. His presentation, titled "Energy-Efficient Circuit Techniques for Emerging Sensor Nodes," provided a comprehensive overview of his research group's latest accomplishments in high-performance signal chain front-ends and capacitive sensing readout chips. The talk delved into areas such as innovative amplifier architectures and time-domain signal processing techniques. These research outcomes offer fresh circuit optimization strategies for future low-power, intelligent edge systems.

Furthermore, the research team headed by Professor Liu Xun from the School of Science and Engineering at The Chinese University of Hong Kong (Shenzhen) also displayed their research results on 3D integrated chips for computing power supply at the conference. Their showcase included a high-frequency, high-density four-phase integrated voltage regulator (IVR) along with an innovative Buck-or-Boost converter topology. These advancements present novel solutions for efficient vertical power supply in next-generation processors and power supply with a wide output voltage range in mobile electronic devices.