Recently, Scoop Technology proudly announced the successful closure of its Series A funding round, amassing over RMB 500 million. This significant financing endeavor was spearheaded by Shanghai Innovation Group, with additional contributions from a diverse array of institutions. Notably, existing shareholders also demonstrated strong confidence by participating in over-subscription investments. The freshly raised capital will be strategically allocated to expedite product development and facilitate commercialization efforts.

Established in May 2021, Scoop Technology has carved out a niche for itself in the design and R&D of intelligent computing power and cloud infrastructure network interconnectivity chips. In a landmark achievement in 2024, the company unveiled its fully independently developed YSA-100 network interconnectivity chip, which swiftly progressed to mass production. This cutting-edge chip has already been deployed across multiple intelligent computing centers, showcasing its robust capabilities.

Presently, Scoop Technology enjoys deep-rooted collaborations with a multitude of internet and operator clients, spanning general-purpose computing and AI intelligent computing scenarios. Several of its products have already reached the stage of mass deployment, a testament to their market acceptance and technical prowess. Furthermore, the company is actively expanding its footprint in the domestic intelligent computing center market, achieving notable breakthroughs in AI intelligent computing scenarios. It has successfully secured multiple key projects and forged deep cooperative ties with several renowned laboratories, paving the way for future growth and innovation.