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On November 7th, TRUMPF Laser revealed on an interactive platform that the company's TGV laser micro-hole drilling equipment had successfully completed the shipment of through-hole equipment designed for panel-level glass substrates. This achievement marks a significant milestone, as it now provides comprehensive coverage of laser technologies for both wafer-level and panel-level TGV packaging.
The company's PCB (Printed Circuit Board) division is primarily focused on advancing ultrafast laser drilling technology. In pursuit of this goal, TRUMPF Laser has initiated collaborations with 2 to 3 key clients. Presently, the prototype of their cutting-edge ultrafast laser drilling equipment is in the midst of trial production, signaling a promising step forward in the field.
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