On October 15, 2025, the Third Chip Conference, coupled with the Award Ceremony for the 'Chip 2024 Top Ten Breakthroughs in Chinese Chip Technology', was inaugurated with great pomp and circumstance in Shenzhen. This grand event was co-hosted by a consortium of prestigious organizations, including the Shenzhen Semiconductor and Integrated Circuit Industry Alliance, Chip Journal, the Wuxi Photonics Chip Research Institute affiliated with Shanghai Jiao Tong University, among others. It coincided with the Bay Area Chip Expo, creating a vibrant hub for industry professionals.

During the conference, Chip Journal took center stage to officially announce the 'Chip 2024 Top Ten Breakthroughs in Chinese Chip Technology', along with the Nomination Awards. The ten groundbreaking advancements that made the cut are as follows:

• Innovative Amorphous P-Type Semiconductor Thin-Film Transistors with CMOS Integration
• Single-Chip Three-Dimensional Integration Process Leveraging Van Der Waals Lamination
• Artificial Sapphire Crystal Dielectrics Paving the Way for Low-Power Chip Development
• Brain-Inspired Complementary Visual Perception Chip 'Tianmou Core', Rooted in Primitive Representation
• Petabyte-Scale Super-Resolution Three-Dimensional Nanophotonic Memory Technology
• Taichi Large-Scale Intelligent Optical Computing Chip
• N-Type Semiconductor Hydrogel
• Fully Degradable Implantable Intracranial Physiological Signal Wireless Monitoring Superhydrogel Chip
• Three-Dimensional Architecture Electronic Skin Mimicking Human Skin's Mechanical Perception
• Hot Emitter Transistor Based on Carrier-Controllable Stimulated Emission