On Thursday, Intel disclosed crucial information about its forthcoming Panther Lake notebook processor. This processor marks Intel's inaugural foray into manufacturing chips using the cutting-edge 18A process technology. Shipments are projected to kick off later this year, with broad market availability anticipated by January 2026. The Panther Lake processor harnesses Intel's 18A process technology, which seamlessly integrates RibbonFET full-surround-gate transistors and PowerVia backside power delivery technology. Additionally, it incorporates Foveros 3D advanced packaging technology. This processor is predominantly geared towards the high-end notebook market that embraces AI capabilities. Its CPU showcases a hybrid architecture design. For the first time, it integrates an Xe3 “Celestial” architecture GPU and comes equipped with a fifth-generation NPU unit. Overall, the AI computing power of this processor soars to 180 TOPS, signifying a 50% performance enhancement compared to its predecessor.