Huada Beidou has recently unveiled its latest innovation—the HD6180, a new-generation BDS-3 short message communication System-on-Chip (SoC). This chip, boasting complete independent intellectual property rights, embodies a highly integrated design that combines baseband and radio frequency functionalities, resulting in a substantial boost in performance, power efficiency, and overall integration.

Manufactured using a cutting-edge 22-nanometer process, the HD6180 integrates RDSS RF transceiver capabilities into a compact form factor, occupying a mere area of approximately 3mm x 3mm post-packaging. Its operational power consumption is impressively low, below 22mW, marking a reduction of over 80% compared to prevailing mainstream products.

When it comes to satellite signal acquisition, the HD6180 excels with an initial acquisition time that does not exceed 2 seconds. Furthermore, its decoding sensitivity reaches an extraordinary -130dBm, outperforming specialized industry standards and significantly enhancing communication success rates in challenging and extreme environments. Additionally, the chip supports both T and P dual-mode demodulation, providing versatile and reliable communication options.