In September 2025, the mobile phone chip market is witnessing cut-throat competition. On September 22, MediaTek stepped into the ring with its Dimensity 9500 flagship 5G intelligent AI chip. This chip leverages TSMC's advanced 3-nanometer N3P process, boasting an impressive AI computing power of 100 TOPS (Tera Operations Per Second) and robust multi-core performance, setting a new benchmark in the industry.

Not to be outdone, Qualcomm made its move just a day later, on September 23, with the launch of the Snapdragon 8 Elite Gen 5 mobile platform. This cutting-edge platform also harnesses the power of TSMC's 3-nanometer process, delivering an astonishing AnTuTu benchmark score ranging from 4.2 to 4.4 million, coupled with exceptional multi-core performance. This score is a testament to its prowess in handling complex tasks and multitasking with ease.

Currently, leading smartphone brands such as Honor, OPPO, vivo, and Xiaomi are all gearing up to introduce smartphones powered by the Snapdragon 8 Elite Gen 5 chip, promising users a seamless and high-performance mobile experience. Meanwhile, the Dimensity 9500 has already secured its spot in the limelight, with confirmed plans to make its debut alongside the highly anticipated vivo X300 series, further intensifying the competition in the premium smartphone segment.