From September 4 to 6, 2025, the 13th Semiconductor Equipment, Core Components, and Materials Exhibition (CSEAC 2025) is set to take place at the Wuxi Taihu International Expo Center. With the theme of "Bolstering China's Chip Industry and Embracing the Global Chip Landscape," this event is structured around four primary exhibition zones: wafer - fabrication equipment, packaging and testing equipment, core components, and materials.

Spanning an exhibition area exceeding 60,000 square meters, the expo is set to draw in over 1,000 exhibiting companies. This represents a year - on - year surge of over 40% in the number of exhibitors. The event will bring together more than 150 overseas companies hailing from 22 countries and regions. It will host the Global Semiconductor Industry Chain Cooperation Forum, along with over 20 professional forums. These forums will zero in on key areas such as chip manufacturing, third - generation semiconductors, and advanced packaging technologies.

Moreover, there will be a dedicated section for showcasing university achievements. Recruitment events will also be organized, facilitating connections between nearly 30 universities and the exhibitors. The expo is anticipated to welcome close to 100,000 visitors. For the first time, it will introduce the "IC Elite Lecture Hall," which will focus on technical domains like AI computing clusters.