According to a research report from CITIC Securities, the rapid expansion of AI computing power infrastructure has spurred a significant increase in demand for printed circuit boards (PCB). High-end production of multi-layer boards, high-density interconnect (HDI) boards, and IC substrates has witnessed substantial growth in output value, prompting domestic manufacturers to actively scale up their production capabilities. By 2025-2026, it is projected that China's leading PCB firms will invest a total of 41.9 billion yuan in various projects. AI servers impose stringent demands on PCBs in terms of usage, density, and performance, necessitating enhanced equipment precision and accelerated equipment wear and tear. Notably, processes such as exposure, drilling, electroplating, and inspection are experiencing the most pronounced benefits. Amidst this AI PCB industry boom, domestic PCB equipment manufacturers are poised to capitalize on these opportunities by accelerating the validation of new technologies, fulfilling increased demand, and consequently expanding their market share and enhancing their overall value.